STMicroelectronics (ST) Releases Open Development Platform for Secure Internet of Vehicles Applications

China / 18 Oct 2017

ST's Modular Telematics Platform (MTP) is an open development environment that enables developers to prototype advanced intelligent driving applications, including vehicle-to-backend servers, road infrastructure connectivity communications, and vehicle-to-vehicle connectivity communications. The MTP platform integrates a central processing unit module based on STMicroelectronics' recently launched Telemaco3P secure telematics processor and a complete set of vehicle networking equipment on circuit boards and plug-in modules, ensuring flexibility and scalability for system development.

The new Telemaco3P in-vehicle safety information processor is already being used by top OEMs and Tier 1 suppliers to replace existing automotive processors. At the same time, the MTP development platform can speed up Telemaco3P application development.

The core component of the MTP development platform is ST's Telemaco3P chip, the industry's first automotive processor to integrate a dedicated hardware security module with state-of-the-art on-chip security features.

The MTP development platform also integrates the STMicroelectronics Teseo automotive-grade multi-satellite system GNSS chip and dead reckoning sensor, and the ST33 onboard

Safety unit option

STMicroelectronics (STMicroelectronics; ST) is the world's leading semiconductor company, providing smart, energy-efficient products and solutions that are relevant to everyday life. ST's products are everywhere, working with customers to enable smart driving, smart factories, smart cities and smart homes, as well as next-generation mobility and IoT products. Enjoy technology, enjoy life, STMicroelectronics advocates the concept of technology leading intelligent life (life.augmented). STMicroelectronics had net revenue of US$6.97 billion in 2016 and has more than 100,000 customers worldwide.